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Huawei MU709 Series Hardware Manual
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Huawei MU709 Series Hardware Manual

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HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Issue
09
Date
2017-12-15

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Summary of Contents for Huawei MU709 Series

  • Page 1 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Issue Date 2017-12-15...
  • Page 2 In order to provide better service, this device will automatically obtain software update information from the Huawei servers after connecting to the Internet. This process will use mobile data, and requires access to your device's unique identifier (IMEI/SN) and the service provider network ID (MCC/MNC) to check whether...

  • Page 3: Revision History

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide About This Document About This Document Revision History Document Date Chapter Descriptions Version 2014-07-16 Creation 2014-09-11 Deleted the Description of RESIN_N pin. 3.4.3 Updated Section 3.4.3: Reset the Module. 2014-09-18 3.4.3 Updated Section 3.4.3: Reset the Module.
  • Page 4 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide About This Document Document Date Chapter Descriptions Version Updated Packaging 6.6.2 Updated Figure 6-4 LGA module Footprint design (Unit: mm) 6.8.2 Updated Stencil Design 6.9.3 Updated Equipment used for rework 2017-06-28 8.13.1 Updated section 8.13.1 EU Regulatory...

  • Page 5: Table Of Contents

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Contents Contents 1 Introduction............................ 8 2 Overall Description ........................9 2.1 About This Chapter ........................... 9 2.2 Function Overview..........................9 2.3 Circuit Block Diagram ........................10 2.4 Application Block Diagram ......................12 3 Description of the Application Interfaces ................
  • Page 6 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Contents 3.12 Reserved Interface ........................44 3.13 NC Interface ..........................44 3.14 Test Points Design ........................45 4 RF Specifications ......................... 46 4.1 About This Chapter ......................... 46 4.2 Operating Frequencies ........................46 4.3 Conducted RF Measurement ......................
  • Page 7 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Contents 6.9 Rework ............................74 6.9.1 Process of Rework ........................ 74 6.9.2 Preparations of Rework ......................74 6.9.3 Removing of the Module......................74 6.9.4 Welding Area Treatment ......................75 6.9.5 Module Installation ......................... 75 6.9.6 Specifications of Rework .......................

  • Page 8: Introduction

    Introduction Introduction This document describes the hardware application interfaces and air interfaces provided by HUAWEI MU709 series (MU709s-2 and MU709s-6) HSPA+ LGA module (hereinafter referred to as the MU709 module). This document helps hardware engineer to understand the interface specifications, electrical features and related product information of the MU709 module.

  • Page 9: Overall Description

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Overall Description Overall Description 2.1 About This Chapter This chapter gives a general description of the MU709 module and provides:  Function Overview  Circuit Block Diagram  Application Block Diagram 2.2 Function Overview...

  • Page 10: Circuit Block Diagram

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Overall Description Feature Description See the HUAWEI MU709 Series HSPA+ Module AT Command Commands Interface Specification. Application One standard USIM (Class B and Class C) interface Interface Audio interface: PCM interface (145-pin LGA USB 2.0 (High Speed)
  • Page 11 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Overall Description Figure 2-1 Circuit block diagram of the MU709 module Nand flash RFIC and Front end circuits Huawei Proprietary and Confidential Issue 09 (2017-12-15) Copyright © Huawei Technologies Co., Ltd.

  • Page 12: Application Block Diagram

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Overall Description 2.4 Application Block Diagram Figure 2-2 Application block diagram of the MU709 module UART Interface: The module supports 2 UART interfaces. One is 8-wire UART0, and the other is 2-wire UART1 (only for debugging).

  • Page 13: Description Of The Application Interfaces

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Description of the Application Interfaces 3.1 About This Chapter This chapter mainly describes the external application interfaces of the MU709 module, including:  LGA Interface  Power Interface ...
  • Page 14 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the MU709 module. Figure 3-1 Sequence of LGA interface (Top view) Table 3-1 shows the definitions of pins on the 145-pin signal interface of the MU709 module.
  • Page 15 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Table 3-1 Definitions of pins on the LGA interface Min. Typ. Max. Pin Name Description Parameter Comments Type UART1_TX UART1 transmit output 1.35 for debugging. 0.45 Not connected...
  • Page 16 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type disabled. –0.3 0.63 The signal is L: Sleep mode is enabled internally pulled (default value). down. The module will be...
  • Page 17 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Reserved Reserved, please keep this pin open. JTAG_TMS JTAG test mode select. 1.26 –0.3 0.63 Reserved Reserved, please keep this pin open.
  • Page 18 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Ground GPIO2 General Purpose I/O 1.35 The function of pins. this pin has not 0.45 been defined. 1.26 –0.3...
  • Page 19 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type SD_CLK SD Card CLK signal. 2.25 Only used for debugging. Please reserve the test 0.75 point. SD_DATA0 SD Card data signal.
  • Page 20 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type UART0_DT Data terminal ready 1.26 –0.3 0.63 UART0_CTS UART0 clear to send 1.26 –0.3 0.63 POWER_ON System power-on or 1.26...
  • Page 21 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type 0.2 x USIM _VCC Reserved Reserved, please keep this pin open. SD_VCC SD Card Power. Only used for debugging.
  • Page 22 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type pins. this pin has not 0.45 been defined. 1.26 –0.3 0.63 Ground Not connected Ground GPIO3/Jam General Purpose I/O pins 1.35...

  • Page 23: Power Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Min. Typ. Max. Pin Name Description Parameter Comments Type Thermal Ground Pad Thermal Ground Pad Thermal Ground Pad Thermal Ground Pad Thermal Ground Pad Thermal Ground Pad...

  • Page 24: Power Supply Vbat Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Table 3-2 Definitions of the pins on the power supply interface Min. Typ. Max. Pin No. Description Parameter Comments Name Type Power supply input. The rising time of...

  • Page 25: Output Power Supply Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces module. In addition, to reduce the impact of channel impedance on voltage drop, you are recommended to try to shorten the power supply circuit of the VBAT interface.

  • Page 26: Power-On/Off Pin

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces  SLEEP_STATUS signal (SLEEP_STATUS) pin  LED signal (LED_MODE) pin Table 3-3 lists the pins on the signal control interface. Table 3-3 Definitions of the pins on the signal control interface...
  • Page 27 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Table 3-4 Two states of POWER_ON_OFF Item Pin state Description Low (when MU709 MU709 module is powered on. module is in power off POWER_ON_OFF pin should be pulled down for state.)

  • Page 28: Resin_N

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Table 3-5 Power on timing Parameter Comments Time (Nominal values) Units POWER_ON_OFF turn on time. > 1.0 POWER_ON_OFF Valid to USB About 7.0 D+ high If the DTE needs to detect the PID/VID of module during the BIOS phase, the detection time should exceed the T time.

  • Page 29: Wakeup_In Signal

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Figure 3-6 Connections of the RESIN_N pin As the RESIN_N and POWER_ON_OFF signals are relatively sensitive, it is recommended that you install a 10 nF–0.1 µF capacitor near the RESIN_N and POWER_ON_OFF pins of the interface for filtering.

  • Page 30: Wakeup_Out Signal

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Figure 3-8 Connections of the WAKEUP_IN pin 3.4.5 WAKEUP_OUT Signal The WAKEUP_OUT signal is used to wake up the external devices. Table 3-3 shows the definition of the WAKEUP_OUT signal.

  • Page 31: Led_Mode Signal

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Figure 3-10 shows recommended circuit of the SLEEP_STATUS pin. Figure 3-10 Connections of the SLEEP_STATUS pin 3.4.7 LED_MODE Signal MU709 module provides an LED_MODE signal to indicate the work status.

  • Page 32: Uart Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Figure 3-11 Driving circuit 3.5 UART Interface 3.5.1 Overview The MU709 module provides the UART0 (8-wire UART) interface for one asynchronous communication channel. As the UART0 interface supports signal control through standard modem handshake, AT commands are entered and serial communication is performed through the UART0 interface.

  • Page 33: Circuit Recommended For The Uart Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. Typ. Max. Type debugging –0.3 0.63 UART0_TX UART0 transmit output 1.35 0.45 UART0_RX UART0 receive data input 1.26 –0.3 0.63 UART0_RING UART0 ring indicator 1.35...

  • Page 34: Usb Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces The RS-232 chip (must support 921600 bit/s) can be used to connect the MU709 module with UART0. In this connection, the Complementary Metal Oxide Semiconductor (CMOS) logic level and the Electronic Industries Association (EIA) level are converted mutually.

  • Page 35: Usim Card Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces USB_DM and USB_DP are required to control the differential impedance 90 Ω (± 10%).   The length of the gap between USB_DM and USB_DP should not exceed 5 mil.

  • Page 36: Circuit Recommended For The Usim Card Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Typ. Pin Name Description Parameter Min.(V) Max.(V) Comments Type 0.25 x USIM_ 0.7 x USIM_VCC USIM_VC USIM card USIM_CLK C=1.8 V or 0.2 x clock 3.0 V USIM_ 1.26...
  • Page 37 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Figure 3-15 Pin definition of USIM Socket Pin 1: USIM_VCC Pin 2: USIM_RESET Pin 3: USIM_CLK Pin 5: Pin 6: VPP(Programming Voltage) Pin 7: USIM_DATA Pin 9:...

  • Page 38: Audio Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces  If the USIM card is absent, USIM_DET pin should be low, and the CD is connected to ground.  To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic...
  • Page 39 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Pin Name Description Parameter Min. Typ. Max. Comments Type 0.45 PCM_CLK PCM clock 1.35 1.80 2.10 The pin is output when the module is used as PCM 0.45...

  • Page 40: General Purpose I/O Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces  It is recommended that a TVS be used on the related interface, to prevent electrostatic discharge and protect IC (Integrated Circuit) components. The signal level of CODEC must match that of the module.

  • Page 41: Jtag Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces 3.10 JTAG Interface The MU709 module provides Joint Test Action Group (JTAG) interface. Table 3-13 shows the signals on the JTAG interface. It is recommended that route out the 5 pins as test points on the DTE for tracing and debugging.
  • Page 42 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Figure 3-19 RF signal trace design about MAIN_ANT for reference (the same for AUX_ANT) Figure 3-20 RF signal layout design about MAIN_ANT for reference (the same for...
  • Page 43 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces For the PCB designed by the user, the impedance of all the RF signal tracks must be 50 Ω. Generally, the impedance depends on the medium factor, track width, and distance from the floor.

  • Page 44: Reserved Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Figure 3-24 RF Pad design for MU709 Please use impedance simulation tool to calculate RF MAIN pad impedance. The RF MAIN pad dimension of the module is 1.1 mm (L) x 0.9 mm (W). You can get the impedance with lower than 50 Ω...

  • Page 45: Test Points Design

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Description of the Application Interfaces Table 3-16 NC pin Pin No. Pin Name Pad Type Description Parameter Min. Typ. Max. 2, 3, 16–27, 33, 37–41, Not connected 47, 82–84, 93–99, 103, 111, 117–120 3.14 Test Points Design...

  • Page 46: Rf Specifications

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide RF Specifications RF Specifications 4.1 About This Chapter This chapter describes the RF specifications of the MU709 module, including:  Operating Frequencies  Conducted RF Measurement  Conducted Rx Sensitivity and Tx Power ...

  • Page 47: Conducted Rf Measurement

    The instrument compensation needs to be set according to the actual cable conditions.  4.3.2 Test Standards Huawei modules meet 3GPP test standards. Each module passes strict tests at the factory and thus the quality of the modules is guaranteed. 4.4 Conducted Rx Sensitivity and Tx Power 4.4.1 Conducted Receive Sensitivity...

  • Page 48: Conducted Transmit Power

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide RF Specifications Band Test Value (Unit: dBm) Note –108.5 GSM 1800 BER Class II < 2.44% –108.5 GSM 1900 BER Class II < 2.44% –110 WCDMA Band 1 Main RX BER < 0.1% –111.5...

  • Page 49: Antenna Design Requirements

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide RF Specifications Band Typical Value (Unit: dBm) Note (Unit: dB) 8PSK(1Tx Slot) ± 2 GSM 1900 GMSK(1Tx Slot) 29.5 ± 1.5 8PSK(1Tx Slot) ± 2 WCDMA Band 1 23.2 ± 1 WCDMA Band 8 23.2...
  • Page 50 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide RF Specifications The following antenna efficiency (free space) is recommended for MU709 to ensure high radio performance of the module: Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710 ...
  • Page 51 The antenna consists of the antenna body and the relevant RF transmission line. Take the RF transmission line into account when measuring any of the preceding antenna indicators.  Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, etc. Huawei Proprietary and Confidential Issue 09 (2017-12-15) Copyright ©...

  • Page 52: Interference

    Use an LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits. Huawei is able to make technical suggestions on radio performance improvement of the module.
  • Page 53 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide RF Specifications Table 4-8 MU709s-6 module antenna requirements GSM/WCDMA Antenna Requirements Frequency range Depending on frequency band(s) provided by the network operator, the customer must use the most suitable antenna for that/those band(s)

  • Page 54: Electrical And Reliability Features

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Electrical and Reliability Features 5.1 About This Chapter This chapter describes the electrical and reliability features in the MU709 module, including:  Absolute Ratings  Operating and Storage Temperatures ...

  • Page 55: Power Supply Features

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Table 5-2 Operating and storage temperatures Specification Min. Max. Unit –20 Normal working temperature ° C –40 Extended temperature ° C –40 Storage temperature ° C Humidity [1]: When the MU709 module works in the range from –40° C to –20° C or +70° C to +85° C, NOT all their RF performances comply with 3GPP specifications.

  • Page 56: Power Consumption

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Electrical and Reliability Features 5.4.2 Power Consumption The power consumption in different scenarios are respectively listed in Table 5-5 to Table 5-9 . The power consumption listed in this section is tested when the power supply is normal voltage (3.8 V) and all of Test values are measured at room temperature.
  • Page 57 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Table 5-7 Averaged Data Transmission DC power consumption of MU709s-2 (HSPA/WCDMA) Description Band Test Value Notes/Configuration (Unit: mA) WCDMA Band 1 0 dBm Tx Power (IMT 2100) 10 dBm Tx Power 23.5 dBm Tx Power...
  • Page 58 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Description Band Test Value Notes/Configuration (Unit: mA) Band 2 0 dBm Tx Power (1900 MHz) 10 dBm Tx Power 23.5 dBm Tx Power Band 5 0 dBm Tx Power...
  • Page 59 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Description Test Value Units Configuration 4 Up/1 Down 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down EDGE 850 1 Up/1 Down 2 Up/1 Down 4 Up/1 Down...

  • Page 60: Reliability Features

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Electrical and Reliability Features  All power consumption test configuration can be referenced by GSM Association Official Document TS.09: Battery Life Measurement and Current Consumption Technique. Test condition: For Max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in ...
  • Page 61 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample size Results Low temperature: –40º C Thermal  JESD22-A1 3 pcs/group Visual inspection: shock 06-B  High temperature: 85º C Function test: ok ...
  • Page 62 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Electrical and Reliability Features Item Test Condition Standard Sample size Results Drop test  0.8 m in height. Drop the IEC60068- 3 pcs/group Visual inspection: module on the marble 2-32 terrace with one surface...

  • Page 63: Emc And Esd Features

    The following are the EMC design comments:  Attention should be paid to static control in the manufacture, assembly, packaging, handling and storage process to reduce electrostatic damage to HUAWEI module.  RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if the antenna port is protected by TVS (Transient Voltage Suppressor), which is resolved by making some adjustment on RF match circuit.
  • Page 64  Effective shielding measures must be taken on the ESD sensitive materials that are transported or stored outside the EPA. HUAWEI MU709 module does not include any protection against overvoltage. Huawei Proprietary and Confidential Issue 09 (2017-12-15) Copyright © Huawei Technologies Co., Ltd.

  • Page 65: Mechanical Specifications

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Mechanical Specifications Mechanical Specifications 6.1 About This Chapter This chapter describes the process design and mechanical specifications:  Storage Requirement  Moisture Sensitivity  Dimensions and Interfaces  Packaging  Customer PCB Design ...

  • Page 66: Dimensions And Interfaces

    Figure 6-1 shows the dimensions in details. Figure 6-1 Dimensions (Unit: mm) 6.5 Packaging HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum packing into cartons. The tray specification complies with Jedec_Tray_DGuide4-10D. Huawei Proprietary and Confidential Issue 09 (2017-12-15)
  • Page 67 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Mechanical Specifications Figure 6-2 ESD pallet (unit: mm) Huawei Proprietary and Confidential Issue 09 (2017-12-15) Copyright © Huawei Technologies Co., Ltd.

  • Page 68: Customer Pcb Design

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Mechanical Specifications The following figure shows the packaging. 6.6 Customer PCB Design 6.6.1 PCB Surface Finish The PCB surface finish recommended is Electroless Nickel Immersion Gold (ENIG). Organic Solderability Preservative (OSP) may also be used, ENIG preferred.

  • Page 69: Pcb Pad Design

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Mechanical Specifications 6.6.2 PCB Pad Design To achieve assembly yields and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: Figure 6-3 MU709 Footprint design (Unit: mm) 6.6.3 Solder Mask...

  • Page 70: Thermal Design Solution

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Mechanical Specifications Figure 6-4 PCB Layout (Unit: mm) 6.7 Thermal Design Solution When the module works in the maximum power condition, the module has high power consumption (for details, see Power Consumption). To improve the module reliability and stability, focus on the thermal design of the device to speed up heat dissipation.
  • Page 71 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Mechanical Specifications Conductive material should be as thin as possible. − The recommended material of the enclosure is metallic materials, especially − you can add pin fin on the enclosure surface. If the heat sink is installed above the shielding case, you should attach the −...

  • Page 72: Assembly Processes

    Figure 6-7 Recommended stencil design of LGA module (unit: mm) The stencil design has been qualified for HUAWEI motherboard assembly, customers can adjust the parameters by their motherboard design and process situation to assure LGA soldering quality and no defect.
  • Page 73 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Mechanical Specifications Figure 6-8 Reflow profile ° C 235° C<Tmax<245° C 60s~100s 45s~80s Table 6-2 Reflow parameters Temperature Zone Time Key Parameter Preheat zone Heating rate: 0.5° C/s–2° C/s (40° C–165° C) Soak zone (t1–t2): 60s–100s...

  • Page 74: Rework

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Mechanical Specifications 6.9 Rework 6.9.1 Process of Rework 6.9.2 Preparations of Rework Remove barrier or devices that can’t stand high temperature before rework.   If the device to be reworked is beyond the storage period, bake the device according to Table 6-1 .

  • Page 75: Welding Area Treatment

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Mechanical Specifications Figure 6-9 Equipment used for rework 6.9.4 Welding Area Treatment Step 1 Remove the old solder by using a soldering iron and solder braid that can wet the solder. Step 2 Clean the pad and remove the flux residuals.
  • Page 76 HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Mechanical Specifications Figure 6-10 Temperature graph of rework Huawei Proprietary and Confidential Issue 09 (2017-12-15) Copyright © Huawei Technologies Co., Ltd.

  • Page 77: Certifications

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Certifications Certifications 7.1 About This Chapter This chapter gives a general description of certifications of the MU709 module. 7.2 Certifications Table 7-1 shows certifications of the MU709 module have been implemented. For more demands, please contact us for more details about this information.

  • Page 78: Safety Information

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Safety Information Safety Information Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed. 8.1 Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.

  • Page 79: Traffic Security

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Safety Information  Area indicated with the "Power off bi-direction wireless equipment" sign  Area where you are generally suggested to stop the engine of a vehicle 8.4 Traffic Security  Observe local laws and regulations while using the wireless device. To prevent accidents, do not use your wireless device while driving.

  • Page 80: Laws And Regulations Observance

    The following approvals and notices apply in specific regions as noted. 8.13.1 EU Regulatory Conformance Statement Hereby, Huawei Technologies Co., Ltd. declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 2014/53/EU. Huawei Proprietary and Confidential Issue 09 (2017-12-15) Copyright ©...

  • Page 81: Fcc Statement

    Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment. Huawei Proprietary and Confidential Issue 09 (2017-12-15)

  • Page 82: Appendix A Circuit Of Typical Interface

    HUAWEI MU709 Series HSPA+ LGA Module Hardware Guide Appendix A Circuit of Typical Interface Appendix A Circuit of Typical Interface J301 J302 C371 22pF MAIN_ANT C365 22pF 0 Ω R341 USIM_VCC R342 0 Ω USIM_RESET R344 SMA6251A1_060_20GHT50GH_50 R343 0 Ω...

  • Page 83: Appendix B Acronyms And Abbreviations

    HUAWEI MU709 Series HSPA+ LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Appendix B Acronyms and Abbreviations Acronym or Abbreviation Expansion 3GPP Third Generation Partnership Project 8PSK 8 Phase Shift Keying Analog To Digital Converter AMPR Additional Maximum Power Reduction...
  • Page 84 HUAWEI MU709 Series HSPA+ LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Data Terminal Equipment Discontinuous Reception Development Kit Envelope Correlation Coefficient EDGE Enhanced Data Rate for GSM Evolution Electronic Industries Association Electromagnetic Compatibility ENIG...
  • Page 85 HUAWEI MU709 Series HSPA+ LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion Liquid Crystal Polyester Low Dropout Regulator Light Emitting Diode Land Grid Array Low Pass Filter Long Term Evolution Multi Chip Package Modulation and Coding Scheme...
  • Page 86 HUAWEI MU709 Series HSPA+ LGA Module Appendix B Acronyms and Hardware Guide Abbreviations Acronym or Abbreviation Expansion RUIM Removable User Identity Module Receive Surface Acoustic Wave Slot Cycle Index SIMO Single Input Multiple Output Short Message Service Surface Mounting Technology...

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