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Siemens SXG 75 Service Manual
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Siemens SXG 75 Service Manual

Siemens SXG 75 Service Manual

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Download this manual See also: User Manual
Release
R 1.0
29.11.2005
R 1.1
22.02.2006
Technical Documentation
TD_Repair_L1-L3_SXG75_R1.1.pdf
Service Manual
SXG 75
Level 1 - 3
Date
Department
BenQ Mobile CC S CES
BenQ Mobile CC S CES
Company Confidential
2005©BenQ
Release 1.1
Notes to change
New document
SWU Process modified
Page 1 of 61
11/2005

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  • Page 1 Release 1.1 Service Manual SXG 75 Level 1 - 3 Release Date Department Notes to change R 1.0 29.11.2005 BenQ Mobile CC S CES New document R 1.1 22.02.2006 BenQ Mobile CC S CES SWU Process modified 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf...

  • Page 2: Table Of Contents

    Release 1.1 Table of Content Key Features ..........................3 SXG75 Interface to Accessories ....................5 Unit Description of SXG75......................6 Exploded View of SXG75 ......................7 Disassembly of SXG75 ......................8 Assembly of SXG75 ........................18 BenQ Service Equipment User Manual .................27 GRT Software: Functionality Configuration................28 GRT Software: Regular Usage ....................30 10 JPICS (Java based Product Information Controlling System) ..........35 11 International Mobile Equipment Identity, IMEI..............41...

  • Page 3: Key Features

    Release 1.1 1 Key Features • Li – Ion Battery Pack Battery • Nominal Capacity: 1000 mAh • GSM Capacity: 980 mAh • Up to 420h Stand – by Time • GSM: Up to 3,6hr Talk Time • WCDMA: Up to 3,1hr •...
  • Page 4 Release 1.1 • Combined handsfree/ringer speaker at rear side of phone, Acoustics next to camera • Dedicated ear piece speaker, allowing small dimensions as not needed as handfree speaker • Uni - directional microphone • Poliphonic ringer tones (parallel to GPRS data transfer: 16 voices;...

  • Page 5: Sxg75 Interface To Accessories

    Release 1.1 2 SXG75 Interface to Accessories The phone has the following compatible interfaces to accessories: electrically by the Lumberg I/O connector (Lumberg slim) antenna connection by courtesy of RF connector IR and Bluetooth interface is implemented Slot wit reader for additional reduced size MultiMediaCard (exchangeable) is available car holder interface is implemented 11/2005...

  • Page 6: Unit Description Of Sxg75

    Additional speciality is a slot for exchangeable RS MultiMediaCard at the side of the phone. The keypad is new for a Siemens brick phone and has beside the usual navigation and number key block beneath the display and the 2 side keys on both side surfaces further 4 edge keys (2 on each side) beside the LCD module for extended UMTS related functionality.

  • Page 7: Exploded View Of Sxg75

    Release 1.1 4 Exploded View of SXG75 Upper Case Side - Keys Side - Cover Keypad Flexible PCB UMTS – Camera Cover Display - Module UMTS - Camera Vibramotor Camera MMC - Holder Microphone Lower Case Earphone Disassembled Camera Cover Screws Battery Battery Cover...

  • Page 8: Disassembly Of Sxg75

    Release 1.1 Disassembly of SXG75 All repairs as well as disassembling and assembling have to be carried out in an ESD protected environment and with ESD protected equipment/tools. For all activities the international ESD regulations have to be considered. For more details please check information in c – market https://market.benqmobile.com/SO/welcome.lookup.asp There you can find the document “ESD Guideline”.
  • Page 9 Release 1.1 Step 3 Remove screws with Torque - Screwdriver. Screws size: T5+ Step 4 Remove Side – Cover by using Alternative Opening Tool carefully. Step 5 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 9 of 61 Company Confidential 2005©BenQ...
  • Page 10 Release 1.1 Step 6 Remove Upper Case by using Alternative Opening Tool carefully. Step 7 Step 8 Disconnect Flex Cable from PCB by using Tweezers carefully. 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 10 of 61 Company Confidential 2005©BenQ...
  • Page 11 Release 1.1 Step 9 Remove MMC Holder by pushing it with Alternative Opening Tool outside the frame. Step 10 Use Alternative Opening Tool to remove PCB from Lower Case carefully. Step 11 To avoid scratches it is mandatory to place a Protection Foil onto the Display.
  • Page 12 Release 1.1 Step 12 Remove Flexible PCB with Alternative Opening Tool carefully. The Loudspeaker is not removable. Step 13 Step 14 Remove Side keys by using Tweezers. 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 12 of 61 Company Confidential 2005©BenQ...
  • Page 13 Release 1.1 Step 15 Step 16 Use Tweezers to remove Keypad. Step 17 Remove Microphone by using Tweezers carefully. Be careful with the spring contacts of the Microphone! 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 13 of 61 Company Confidential 2005©BenQ...
  • Page 14 Release 1.1 Step 18 Remove Vibramotor by using Tweezers carefully. Step 19 Remove Earphone by using Tweezers carefully. Step 20 Use Alternative Opening Tool to remove Camera Cover carefully. 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 14 of 61 Company Confidential 2005©BenQ...
  • Page 15 Release 1.1 Step 21 Step 22 Step 23 Disconnect Flex Cable from PCB with Tweezers. 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 15 of 61 Company Confidential 2005©BenQ...
  • Page 16 Release 1.1 Step 24 Remove Display from PCB by using Alternative Opening Tool very carefully. Step 25 Put the Camera Ejector Jig professional through the four edges between the Camera and the Camera Connector. Now push the Ejector Jig and pull out the Camera carefully.
  • Page 17 Release 1.1 Step 27 Step 28 Remove UMTS Camera with Alternative Opening Tool very carefully. Overview Lower Parts Overview Upper Parts Upper Case Flexible PCB Display Side - Cover Battery Rear Cover Lower Case Microphone Vibramotor Earphone MMC - Holder Camera Cover Keypad Disassembled...

  • Page 18: Assembly Of Sxg75

    Release 1.1 6 Assembly of SXG75 Step 1 Assemble UMTS - Camera by using Tweezers. Step 2 Connect the UMTS – Camera with PCB by using Tweezers. Step 3 Use Tweezers to assemble Camera Cover. 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 18 of 61 Company Confidential 2005©BenQ...
  • Page 19 Release 1.1 Step 4 Assemble Camera by using Camera Ejector Jig. Step 5 Assemble Display by fixing it in the given frame. Take care of the Display! Step 6 Assemble Camera Cover. 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 19 of 61 Company Confidential 2005©BenQ...
  • Page 20 Release 1.1 Step 7 Step 8 Assemble Earphone by using Tweezers carefully. Step 9 Assemble Vibramotor by using Tweezers carefully. 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 20 of 61 Company Confidential 2005©BenQ...
  • Page 21 Release 1.1 Step 10 Assemble Microphone by using Tweezers. Be careful with the spring contacts of the Microphone! Step 11 Assemble Side keys with Tweezers. Step 12 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 21 of 61 Company Confidential 2005©BenQ...
  • Page 22 Release 1.1 Step 13 Use Tweezers to assemble Keypad. Step 14 Assemble Flexible PCB by using Tweezers. Push it carefully with both thumbs in the Upper Case. Step 15 Before assembling PCB in the Upper Case, remove Display Foil!!! 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 22 of 61...
  • Page 23 Release 1.1 Step 16 Step 17 Assemble PCB by fixing it in the Upper Case. Step 18 To assemble PCB connect it with Flex Cable. 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 23 of 61 Company Confidential 2005©BenQ...
  • Page 24 Release 1.1 Step 19 Assemble MMC holder by pushing it in the given frame. Step 20 Fix the Upper Case on the before assembled Lower Case and PCB. Step 21 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 24 of 61 Company Confidential 2005©BenQ...
  • Page 25 Release 1.1 Step 22 Place screws by using Torque – Screwdriver. Top screw (Antenna): Screw size: T5+ Torque: 17 cNm Centre/ Bottom screws: Screw size: T5+ Torque: 20 cNm Step 23 Assemble side – cover. Press the side cover onto the frame. Step 24 Assemble Rear Cover.
  • Page 26 Release 1.1 Step 25 Assemble Battery. Step 26 Assemble Battery Cover. 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 26 of 61 Company Confidential 2005©BenQ...

  • Page 27: Benq Service Equipment User Manual

    Release 1.1 BenQ Service Equipment User Manual Introduction Every LSO repairing BenQ handset must ensure that the quality standards are observed. BenQ has developed an automatic testing system that will perform all necessary measurements. This testing system is known as: BenQ Mobile Service Equipment •...

  • Page 28: Grt Software: Functionality Configuration

    Release 1.1 GRT Software: Functionality Configuration Note: Not implemented in GRT Version 3.x. For Software Update please use the tool 3GSWUP_FU. Manual and Software are available in the Technical Support section of the C-market. Select „Settings >> SWUP / JPICS” Sep 1: Proceed as follows Step 2:...
  • Page 29 Release 1.1 Connect to GRM Server Step 3: • Choose in the section „GRM” the „Connect to GRM Database“ functionality Enter your GRT-Username and Password into this fields Activate always both boxes if you connect to the database. Start with “Connect” It you IT infrastructure parameter have changed, use this button to move to the configuration mask...

  • Page 30: Grt Software: Regular Usage

    Personal Repair Personal Repair is always accessible. Basis for the decision if a SW-Update is authorised by Siemens is the so called Service Release-Table . Example: Mobile Phone has already SW50. Service -Release-Table shows SW50 In this case SW-Update is not necessary and therefore not authorised In any case customer data can be erased on request.
  • Page 31 Release 1.1 9.1 Window explanation This general explanation is valid for all SW-Update channels (Personal Repair, Operator SWAP, Operator SWUpdate) After using „Check Variant“ Phone IMEI- Number will be shown here Window to select the mobile phone CPU Shows the different SW –Versions a) SW inside the mobile phone b) Version of Service Release Table c) Version of Master Table SW...
  • Page 32 >>Appears in the window above. Remarks: The decision about a Siemens authorised SW-Update depends only on the Service Release-Table . The SW which is booted by GRT can be below the SW mentioned in the Service Release Table, if this SW is not released for the Net-Operator If xfs and mapping are activated, GRT will erase in any case the customer data even if the action is cancelled.
  • Page 33 >>Appears in the window above. Remarks: The decision about a Siemens authorised SW-Update depends only on the Master-Table . The user has no chance to influence the decision Xfs and mapping are always activated there is no chance to deactivate them.
  • Page 34 >>Appears in the window above. Remarks: The decision about a Siemens authorised SW-Update depends only on the Master-Table . The user has no chance to influence the decision Xfs and mapping can be activated on demand. GRT will erase in any case the customer data even if the action is cancelled.

  • Page 35: Jpics (Java Based Product Information Controlling System)

    Release 1.1 JPICS (Java based Product Information Controlling System) Overview The following functions are available for the LSO: • General mobile information • Generate PINCODE • Generate SIMLOCK – UNLOCK – Code • Print IMEI labels • Lock, Unlock and Test the BF - Bus 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf...
  • Page 36 Release 1.1 The access to the JPICS server which is located in Kamp – Lintfort is protected by chip card and in addition using secure socket layer (SSL) connection. The JPICS server is only available for authorized users with a specially coded smart card. These smart cards and the administration of the JPICS web server and the PICS database –...
  • Page 37 Here is a step by step instruction to install all the required components: It is necessary to follow this order! 1. Smart Card Reader (Omnikey: Cardman 2020 USB or Cardman 3121 USB) 2. CardOS interface (Siemens Version 3.0 B) 3. Java Runtime Environment (Sun) 4. Java additional components Every user is responsible for a proper installation matching the license agreements.
  • Page 38 Release 1.1 Generate Codes In the JPICS application you can choose to generate: • Masterphone codes • Simlock – Unlock – Codes Masterphone codes The Masterphone code is used to unlock blocked mobiles. Masterphone codes can only be supplied for mobiles which have been delivered in a regular manner.
  • Page 39 Release 1.1 Simlock – Unlock – Code The Simlock – Unlock – Codes can only be generated if the following conditions are given: • Mobile must have an active Simlock inside. • The user must be given the authorization to obtain Simlock – Unlock – Codes for the variant of the operator to which the mobile was delivered last time.
  • Page 40 Release 1.1 Printing IMEI label The module “printing IMEI label” offers the possibility to re-print IMEI labels for mobiles again. You are able to print 1 label in just one step. To prevent that misaligned labels are being printed, the setting “Print test labels = ”...

  • Page 41: International Mobile Equipment Identity, Imei

    Release 1.1 International Mobile Equipment Identity, IMEI The mobile equipment is uniquely identified by the International Mobile Equipment Identity, IMEI, which consists of 15 digits. Type approval granted to a type of mobile is allocated 6 digits. The final assembly code is used to identify the final assembly plant and is assigned with 2 digits.

  • Page 42: General Testing Information

    The technical instruction for testing GSM mobile phones is to ensure the best repair quality. Validity This procedure is to apply for all from Siemens AG authorized level 2 up to 2.5e workshops. Procedure All following checks and measurements have to be carried out in an ESD protected environment and with ESD protected equipment/tools.
  • Page 43 Release 1.1 Incoming check and check after assembling: !! Verify the customers fault description!! After a successful verification pass the defective item to the responsible troubleshooting group. If the fault description can not be verified, perform additional tests to save time and to improve repair quality.
  • Page 44 Release 1.1 GSM Test: With the availability of the GRT Test /Alignment software, this tool has to be used to perform the outgoing test! >Connect the mobile/board via internal antenna (antenna coupler) and external antenna (car cradle/universal antenna clip) to a GSM tester >Use a Test SIM For Triple Band phones use a separate test case, if the test software allows only one handover.
  • Page 45 Release 1.1 External Antenna Call from MS • GSM900 • Keyboard check • individual • high TCH check • second highest PCL • BS Power = -75 dBm • middle BCCH TX GSM Band 1 • high TCH • Frequency Error •...
  • Page 46 Release 1.1 WCDMA Test: With the availability of the GRT Test /Alignment software, this tool has to be used to perform the outgoing test! >Connect the mobile/board via internal antenna (antenna coupler) and external antenna (car cradle/universal antenna clip) to a WCDMA tester >Use a Test USIM Internal Antenna Test case...
  • Page 47 Release 1.1 Annex 1 Test SIM Card There are two different “Test SIM Cards” in use: 1) Test SIM Card from the company “ORGA” Pin 1 number: 0000 PUK 1 12345678 Pin 2 number: 0000 PUK 2 23456789 2) Test SIM Card from the company “T-D1” Pin 1 number: 1234 76543210...
  • Page 48 Release 1.1 Annex 2 Battery Date Code overview Varta Date code example N 9 A VA Year (N:2001, O:2002...) Supplier Code Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking) Revision Letter (A, B,…) Hitachi / Maxwell Date code example N 9 A MX Year (N:2001, O:2002...) Supplier Code Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec)

  • Page 49: Introduction Of Service Repair Documentation Level 3 - Sxg75

    Release 1.1 Introduction of Service Repair Documentation Level 3 – SXG75 13.1 Purpose This Service Repair Documentation is intended to support Service partners to carry out repairs on BenQ repair level 3. The described failures shall only be repaired in BenQ authorized local workshops.

  • Page 50: List Of Available Level 2.5Light Parts

    Release 1.1 List of available level 3 (basic) parts (according to Component Matrix V1.19 - check C-market for updates) Product Order Number Description CM SXG75 V2100 L36197-F5008-F492 IRDA 115.2 KBIT SXG75 X100 L36334-Z93-C303 IO-JACK SLIM 12-POL SXG75 X1100 L36334-Z97-C213 CONNECTOR BATTERY 3-POL SXG75 X1400 L50634-Z97-C348...

  • Page 51: Sxg75 Board Layout

    Release 1.1 SXG75 Board layout Upper board side Connector Display Connector Front Camera Lower board side Connector Connector Connector Connector IRDA Battery Board to SIM Card Antenna Board 20 IO Jack Reader Slim Connector Connector RS – MMC Camera socket 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf...

  • Page 52: Sim Card Problems

    Release 1.1 SIM Card Problems Fault Symptoms Customer: GRT: Handset does not accept SIM card SIM Card Problems Back to customer SIM Card Problems without repair okay Watch for oxidation and caused by customer damaged pads of the SIM Card reader SCRAP - has to be send separately to WSC...

  • Page 53: Io Connector Problems

    Release 1.1 IO Connector Problems Fault Symptoms Customer: GRT: Charging Problems No connection to GRT Problems with external loudspeaker or microphone when using a car kit Problems with accessories connected at the IO connector Back to customer IO connector Problems without repair okay Watch for oxidation and...
  • Page 54 Release 1.1 Important additional soldering hints The MMC Reader is located on the opposite of the SLIM-Lumberg connector. Therefore the risk to damage the plastic material of this MMC-Reader is potentially high if excessive heat is used while removal or soldering of the SLIM-Lumberg connector. Please follow these instructions: a) Remove the SLIM-Lumberg connector with a soldering iron and Desolder Wick b) Clean the Pads afterwards...

  • Page 55: To B Connector Problems

    Release 1.1 B to B connector Problems Fault Symptoms Customer: GRT: Upper slider keyboard malfunction Keyboard malfunction Upper slider keypad illumination does not work Current measured failed Display problems Back to customer B to B connector problems without repair okay Watch for oxidation and caused by customer damaged pads of the...

  • Page 56: Battery Connector Problems

    Release 1.1 Battery Connector Problems Fault Symptoms Customer: GRT: Mobile does not switch on No connection to GRT Back to customer Battery connector problems without repair okay Watch for oxidation and caused by customer damaged pads of the battery connector okay SCRAP - has to be send...

  • Page 57: Camera Connector Problems

    Release 1.1 Camera Connector Problems Fault Symptoms Customer: GRT: Camera malfunction Tbd. Back to customer Camera connector Problems without repair okay Watch for oxidation and caused by customer damaged pads of the camera connector okay SCRAP - has to be send separately to WSC - check for twisted or okay...

  • Page 58: Irda Problems

    Release 1.1 IRDA Problems Fault Symptoms Customer: GRT: No infrared connection possible Tbd. Back to customer IRDA Problems without repair okay Watch for oxidation and caused by customer damaged pads of the IRDA okay SCRAP - has to be send separately to WSC - check for twisted or Check the status of the...

  • Page 59: Display Problems

    Release 1.1 Display Problems Fault Symptoms Customer: GRT: Display problems Current measured failed Back to customer Display Problems without repair okay Watch for oxidation and caused by customer damaged pads of the Display connector okay SCRAP - has to be send separately to WSC - check for twisted or okay...

  • Page 60: Mmc Connector Problems

    Release 1.1 MMC Connector Problems Fault Symptoms Customer: GRT: MMC malfunction Tbd. Back to customer MMC connector problems without repair okay Watch for oxidation and caused by customer damaged pads of the MMC connector okay SCRAP - has to be send separately to WSC - check for twisted or okay...
  • Page 61 Release 1.1 11/2005 Technical Documentation TD_Repair_L1-L3_SXG75_R1.1.pdf Page 61 of 61 Company Confidential 2005©BenQ...

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